Understand the application.
Input materials
Output
Remove components before further board processing
PCB dismantling concerns separating mounted components from the board assembly. It is a distinct task from crushing board material or refining recovered metals. Identify the boards you receive, the types of mounted items and whether selective component handling is required.
Describe the incoming assemblies
Provide photographs of representative boards and difficult assemblies. Note attachments, remaining housings and any preparation already completed. Agree which assemblies are suitable for the proposed arrangement and how the removed components and remaining board material will be collected as separate outputs.
Connect dismantling to the next stage
State whether the board material will enter another processing line and what that equipment accepts. Define the dismantling package and its handling requirements separately from downstream crushing, sorting or precious-metal treatment. A complete recovery project needs an agreed boundary for each of those duties.
Specifications & configurations.
Tell us about your material and required configuration to discuss the relevant specifications.
Before you decide
Does component removal produce refined precious metal?
No. Dismantling separates parts from board assemblies. Any subsequent material recovery or refining is a separate process scope.
What should be shown before choosing a configuration?
Show typical boards, mounted components, housings and attachments, together with the required handling of the resulting fractions.
